Promising materials for microelectronics, optoelectronics, microwave and other advanced technologies are gallium arsenide, indium arsenide, gallium antimonide and indium antimonide. For the application in ionization radiation detectors, optoelectronic devices, such as light-emitting diodes and semiconductor lasers, and in the other high-tech areas of science and industry, it is required that output data of plates comply with the values of TTV, TIR, Bow and Warp included in the international standard SEMI. The article considers methods to process plates, processing equipment, technology of one-side bound-abrasive polishing on experimental plant EM-2060 manufactured by Planar and the plant control system. The results of processing of plates are reported. Roughness of a polished gallium arsenide plate 100 mm was measured using Alpha-Step® D-500 Profiler by KLA Tencor, USA. The measurement data are: Ra 16 nm, Rz 76 nm. The problems to be solved to reach the required parameters and quality of processed plates are identified.


Gallium arsenide, indium arsenide, gallium antimonide, indium antimonide, microelectronics, optoelectronics, surface finishing, plates, roughness.

Issue number: 8
Year: 2018
UDK: 621.921:658.562
DOI: 10.25018/0236-1493-2018-8-0-26-35
Authors: Biryukov E. N., Khokhlov A. I., Teplova T. B., Lapshin I. V.

About authors: Biryukov E.N., General Director, LLC «Fianit-Intex», Khokhlov A.I. (1), Candidate of Technical Sciences,, Leading Researcher, e-mail:, Teplova T.B., Doctor of Technical Sciences, Professor, e-mail:, Lapshin I.V. (1), Chief Specialist, e-mail:, 1) State Corporation «Rosatom», JSC «State Scientific-Research and Design Institute of Rare Metal Industry «Giredmet», Moscow, Russia.


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